Advanced packaging

With trim & form and singulation

 

Sempro provides packaging services for a variety of industrial companies. Sempro is a tool manufacturer that works together with the Advanced Packaging Center when they need trim & form and singulation tools. This often happens in the preliminary stages of a development project for a new semiconductor device.

The Advanced Packaging Center offers companies a one-stop-shop concept. There are many types of semiconductor devices that require highly-innovative packaging solutions.

The Advanced Packaging Center offers the services in the Netherlands to develop packages for below listed devices, and package them in small series:

  • Powers
  • Sensors
  • MEMS
  • IC’s

 

How Sempro and the Advanced Packaging Center are connected?

 

When APC needs a custom solution from Sempro for their trim/form or singulation processes, we are always there to help them out. This fruitful partnership has existed for several years now. Sempro has multiple locations and so does the Advanced Packaging Center.

Fortunately, both our headquarters are located in the Netherlands. So, if a new device is needed at the Advanced Packaging Center, Sempro can provide trim & form and singulation tools to be operated manually or semi-automatic, so that samples can be made.

Sempro Europe


Roggeweg 28
6534 AJ Nijmegen,
The Netherlands
+31 487511863

info@sempro.nl

Sempro ASIA


15A Lintang Sungai Tiram 5
Sunway Prima, Bayan Lepas
11900 Penang, Malaysia
+604 6442235

    Our company 

Every trim & form and singulation challenge is an opportunity for us to push the boundaries for our clients, opening up new paths and creating new possibilities.

We think in solutions

Sempro can help make your ideas a reality.

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